| PART |
Description |
Maker |
| 10033854-052TSLF 10033854-152TSLF 10033854-252TSLF |
DDR II 0.6mm PITCH 200 POS REVERSE TYPE ASSY
|
FCI connector
|
| 10033853-052TSLF 10033853-152TSLF 10033853-232TSLF |
DDR II 0.6mm PITCH 200 POS STANDARD TYPE ASSY
|
FCI connector
|
| KM48L16031BT-GFZ/Y/0 KM416L8031BT-GFZ/Y/0 KM44L160 |
DDR SDRAM Specification Version 0.61 DDR SDRAM的规格版.61
16M X 8 DDR DRAM, 0.8 ns, PDSO66 0.400 X 0.875 INCH, 0.65 MM PITCH, MS-024FC, TSOP2-66
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| 87918-0202 0879180202 |
0.60mm (.024) Pitch miniDIMM DDR Socket, Surface Mount, Right Angle, 2.5V Key, 200 Circuits, Lead-free
|
Molex Electronics Ltd.
|
| W5232 W523X W5231 W5233 W5234 |
Power Speech LOW VOLTAGE ADPCM VOICE SYNTHESIZER
ADPCM Synthesizer w/ 4 triggers, STA, STB, STC, R0 (6 seconds @6.7K)
ADPCM Synthesizer w/ 4 triggers, STA, STB, STC, R0 (12 seconds @6.7K)
ADPCM Synthesizer w/ 4 triggers, STA, STB, STC, R0 (9 seconds @6.7K)
ADPCM Synthesizer w/ 4 triggers, STA, STB, STC, R0 (3 seconds @6.7K)
|
WINBOND[Winbond]
Winbond Electronics
|
| 0712513101 71251-3101 |
1.27mm (.050) Pitch DIMM Socket, Vertical, Multiple Keys, Plastic Peg, 200 Circuits2.5V DDR, 10.00mm (.394) Latch Length
|
Molex Electronics Ltd.
|
| HMP125S6EFR8C-C4 HMP125S6EFR8C-S5 HMP125S6EFR8C-S6 |
256M X 64 DDR DRAM MODULE, 0.45 ns, ZMA200
256M X 64 DDR DRAM MODULE, 0.4 ns, ZMA200 HALOGEN FREE AND ROHS COMPLIANT, SODIMM-200
128M X 64 DDR DRAM MODULE, 0.4 ns, ZMA200 HALOGEN FREE AND ROHS COMPLIANT, SODIMM-200
200pin Unbuffered DDR2 SDRAM SO-DIMMs
|
HYNIX SEMICONDUCTOR INC
Hynix Semiconductor, Inc.
|
| GS8182S18GD-267 GS8182S18GD-267T GS8182S18GD-267I |
1M X 18 DDR SRAM, 0.45 ns, PBGA165 13 X 15 MM, 1 MM PITCH, MO-216CAB-1, LEAD FREE, FBGA-165
18Mb Burst of 2 DDR SigmaSIO-II SRAM 1M X 18 DDR SRAM, 0.45 ns, PBGA165
|
GSI Technology, Inc.
|
| KSA025-80T KSA006-80T RNA009-08G KSA015-79T KSA035 |
25 POS PEEL-A-WAY® SIP ADAPTER SIP25, IC SOCKET
6 POS PEEL-A-WAY® SIP ADAPTER SIP6, IC SOCKET
9 POS MOLDED SIP ADAPTER SIP9, IC SOCKET
15 POS PEEL-A-WAY® SIP ADAPTER SIP15, IC SOCKET
35 POS PEEL-A-WAY® SIP ADAPTER SIP35, IC SOCKET
13 POS MOLDED SIP ADAPTER SIP13, IC SOCKET
12 POS MOLDED SIP ADAPTER SIP12, IC SOCKET
7 POS MOLDED SIP ADAPTER SIP7, IC SOCKET
30 POS MOLDED SIP ADAPTER SIP30, IC SOCKET
40 POS PEEL-A-WAY® SIP ADAPTER SIP40, IC SOCKET
31 POS PEEL-A-WAY® SIP ADAPTER SIP31, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| FX8C-060_060P11-SV1J FX8C-060_060P11-SV2J FX8C-060 |
0.6mm Pitch Stacking Height 3mm to 16mm Connector
2.67K 1% 100PPM MF
0.6mm Pitch Stacking Height 3mm to 16mm Connector 0.6毫米间距堆叠高度3毫米16毫米连接
0.6mm Pitch Stacking Height 3mm to 16mm Connector 0.6毫米间距堆叠高度3毫米6毫米连接
100 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
120 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
|
HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
|
| DS624-03TG DS318-30TG DS318-02GG DS314-30TG DS314- |
24 POS MOLDED DIP SOCKET DIP24, IC SOCKET
18 POS MOLDED DIP SOCKET DIP18, IC SOCKET
14 POS MOLDED DIP SOCKET DIP14, IC SOCKET
28 POS MOLDED DIP SOCKET DIP28, IC SOCKET
20 POS MOLDED DIP SOCKET DIP20, IC SOCKET
40 POS MOLDED DIP SOCKET DIP40, IC SOCKET
|
Advanced Interconnections, Corp.
|
|
